159

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Die Characteristics

DIE DIMENSIONS:

136 x 167 x 19

±1mils

METALLIZATION:

Type: Si - Al

Thickness: 11k

Å

GLASSIVATION:

Thickness: 8k

Å

WORST CASE CURRENT DENSITY:

LEAD TEMPERATURE (10s soldering):

Metallization Mask Layout

HM-6514/883

NOTE:

1.

Pin numbers correspond to DIP Package only.

A5

A6

VCC

A7

A8

A9

A0

A1

A2

E

GND W

DQ3

DQ2

DQ1

DQ0

A4

A3

HM-6514/883