Preliminary Data Sheet

1.0

FMS2003 ES1

SP4T Bonding Configuration

Pad Number

Port

Symbol

Connection on Board

1

RF input port 1

RF 1

RF4

2

DC Control line 1

Vctrl 1

V1

3

Antenna*

ANT

ANT

4

DC Control line 3

Vctrl 3

V2

5

RF input port 3

RF 3

RF5

6

RF input port 2

RF 2

RF1

7

DC Control line 2

Vctrl 2

V4

8

Antenna*

ANT

RF3*

9

DC Control line 4

Vctrl 4

V3

10

RF input port 4

RF 4

RF2

* Either or both of the antenna pads can be bonded. They are electrically the same.

Bonding Pad Layout

0.00 µm

SP4T F1

5

4

2

3

1

6

78

9

10

561.9 µm (x)

694.5

217.78 µm (x)

706.75

455 µm (x)

706.75

692.22 µm (x)

706.75

853.81 µm (x)

694.5

133.25

133.25

133.25

145.5

145.5

561.9 µm (x)

217.78 µm (x)

455 µm (x)

692.22 µm (x)

853.81 µm (x)

SP4T F1

SP4T F1

5

4

2

3

1

6

78

9

10

561.9 µm (x)

694.5

217.78 µm (x)

706.75

455 µm (x)

706.75

692.22 µm (x)

706.75

853.81 µm (x)

694.5

133.25

133.25

133.25

145.5

145.5

561.9 µm (x)

217.78 µm (x)

455 µm (x)

692.22 µm (x)

853.81 µm (x)

Preliminary specifications subject to change without notice

Filtronic Compound Semiconductors Ltd, Heighington Lane Business Park, Newton Aycliffe, Co Durham. DL5 6JW.