Advanced Product Information

1.1

2

Preliminary specifications subject to change without notice

Filtronic Compound Semiconductors Ltd

Contact Details (UK): Tel: +44 (0) 1325 301111 Fax: +44 (0) 1325 306177 Email: sales@filcs.com

Contact Details (USA): Tel: +1 (408) 850 5790

Fax: +1 (408) 850 5766

FMS2022

Truth Table:

Control Lines

RF Path

-5V

0V

0V

-5V

0V

-5V

0V

-5V

ON

OFF

OFF

OFF

0V

-5V

-5V

0V

0V

-5V

0V

-5V

OFF

ON

OFF

OFF

0V

-5V

0V

-5V

-5V

0V

0V

-5V

OFF

OFF

ON

OFF

0V

-5V

0V

-5V

0V

-5V

-5V

0V

OFF

OFF

OFF

ON

Note: -5V

± 0.5V, 0V+0.5V

Pad Layout:

Note: Co-ordinates are referenced from the bottom left hand corner of the die to the centre of the

bond pad opening

Die Size

( µm x µm )

Die Thickness (

µm)

Min. Bond Pad

Pitch(

µm)

Min. Bond pad

Opening (

µm xµm )

950 x 1320

150

130

94 x 94

Pad

Reference

Description

Pin Coordinates

(µm)

IN

RFIN

142,657.5

OUT1

RFOUT1

142,1174

OUT2

RFOUT2

675,1174

OUT3

RFOUT3

675,141

OUT4

RFOUT4

142,141

A1

A1

805,878

B1

B1

805,731

A2

A2

805,1172

B2

B2

805,1025

A3

A3

805,290

B3

B3

805,143

A4

A4

805,584

B4

B4

805,437

GND1

GND

504,1174

GND2

GND

504,141

GND3

GND

142,869

GND4

GND

142,446

IN

GND3

GND4

A2

B2

A1

B1

A4

B4

A3

B3

OUT1

GND1 OUT2

OUT4

GND2 OUT3