FPD2000AS datasheet(2/7 Pages) FILTRONIC

2 / 7 page

PRELIMINARY

FPD2000AS

2W PACKAGED POWER PHEMT

Phone: +1 408 850-5790

http:// www.filcs.com

Revised: 05/03/04

Fax: +1 408 850-5766

Email: sales@filcsi.com

•

RECOMMENDED OPERATING BIAS CONDITIONS

Drain-Source Voltage:

From 5V to 10V

Quiescent Current:

From 25% IDSS to 55% IDSS

•

ABSOLUTE MAXIMUM RATINGS1

Parameter

Symbol

Test Conditions

Min

Max

Units

Drain-Source Voltage

VDS

-3V < VGS < +0V

Gate-Source Voltage

VGS

0V < VDS < +8V

-3

Drain-Source Current

IDS

For VDS > 2V

IDSS

Gate Current

Forward / Reverse current

+15/-2

RF Input Power2

Under any acceptable bias state

900

Channel Operating Temperature

TCH

Under any acceptable bias state

175

ºC

Storage Temperature

TSTG

Non-Operating Storage

-40

150

ºC

Total Power Dissipation

PTOT

See De-Rating Note below

7.6

Gain Compression

Comp.

Under any bias conditions

Simultaneous Combination of Limits3

2 or more Max. Limits

1TAmbient = 22°C unless otherwise noted

2Max. RF Input Limit must be further limited if input VSWR > 2.5:1

3Users should avoid exceeding 80% of 2 or more Limits simultaneously

Notes:

•

Operating conditions that exceed the Absolute Maximum Ratings will result in permanent damage to the device.

•

Total Power Dissipation defined as: PTOT ≡ (PDC + PIN) – POUT, where:

PDC: DC Bias Power

PIN: RF Input Power

POUT: RF Output Power

•

Total Power Dissipation to be de-rated as follows above 22

°C:

PTOT= 7.6 - (0.05W/°C) x TPACK

where TPACK = source tab lead temperature above 22°C

(coefficient of de-rating formula is the Thermal Conductivity)

Example: For a 55

°C source lead temperature: PTOT = 7.6 - (0.05 x (55 – 22)) = 5.95W

•

For optimum heatsinking, metal-filled through (Source) via holes should be used directly below the central

metallized ground pad on the bottom of the package.

•

Note on Thermal Resistivity: The nominal value of 20

°C/W is measured with the package mounted on a large

heatsink with thermal compound to ensure adequate (unsoldered) contact. The package temperature is referred to

the Source leads.

•

HANDLING PRECAUTIONS

To avoid damage to the devices care should be exercised during handling. Proper Electrostatic

Discharge (ESD) precautions should be observed at all stages of storage, handling, assembly, and

testing. These devices should be treated as Class 1A per ESD-STM5.1-1998, Human Body Model.

Further information on ESD control measures can be found in MIL-STD-1686 and MIL-HDBK-263.

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