2

IR2171/IR2172

www.irf.com

Symbol

Definition

Min.

Max.

Units

High side offset voltage

-0.3

600

High side floating supply voltage

-0.3

25

Low side and logic fixed supply voltage

-0.3

25

-5

5

Digital PWM output voltage

COM -0.3

VCC +0.3

Overcurrent output voltage (IR2172)

COM -0.3

VCC +0.3

dV/dt

Allowable offset voltage slew rate

—

50

V/ns

8 lead SOIC

—

.625

8 lead PDIP

—

1.0

Thermal resistance, junction to ambient

8 lead SOIC

—

200

8 lead PDIP

—

125

Junction temperature

—

150

Storage temperature

-55

150

Lead temperature (soldering, 10 seconds)

—

300

Absolute Maximum Ratings

Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage

parameters are absolute voltages referenced to COM, all currents are defined positive into any lead. The thermal

resistance and power dissipation ratings are measured under board mounted and still air conditions.

V

°C/W

W

Note 1: Capacitors are required between VB and Vin-, and between VB and Vs pins when bootstrap power is used. The

external power supply, when used, is required between Vs and Vin-, and between VB and Vs pins.

°C

Recommended Operating Conditions

The output logic timing diagram is shown in figure 1. For proper operation the device should be used within the recom-

mended conditions.

Symbol

Definition

Min.

Max.

Units

High side floating supply voltage

High side floating supply offset voltage

0.3

600

Digital PWM output voltage

COM

VCC

Overcurrent output voltage

COM

VCC

Low side and logic fixed supply voltage

9.5

20

-260

+260

mV

Ambient temperature

-40

125

°C

V