R200 datasheet(32/51 Pages) INTEL

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System Integration

334616-001

Figure 7-7. Example of Gasket Material Placement

Figure 7-8. Example of Separated Windows for Cover Material

7.8.4

Dust Protection

Dust particles can accumulate over the camera lenses which can be visually

unappealing and degrade image quality.

7.9

Thermal Design Guidance

While necessary to avoid module flex, the air gap around the module creates thermal

challenges. Without thermal management, cameras on the module can be

permanently damaged. Most system designs do not have sufficient free space to allow

for air convection based cooling methods. This section lists a number of strategies that

can be used to successfully meet module and system thermal requirements.

It is strongly recommended to use thermal modeling to simulate a chassis design

before implementation. Any simulations should be correlated with empirical

measurements to verify the simulated behavior is accurate.

In general it is recommended to place the camera module, SoC, and display driver as

far apart as possible to minimize the thermal dissipation solution as shown in Figure

7-9.

R200 데이터시트(PDF) 32 Page - Intel Corporation