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PDS-PXE1-PXM1-C-001A

3

Absolute Maximum Ratings

Subjecting the controller to stresses above those listed in Table 3 may cause permanent damage to the device.

These are absolute stress ratings only and operation of the device is not implied or recommended at these or any

other conditions in excess of those given in the operational sections of this specification. Exposure to the absolute

maximum ratings for extended periods may adversely affect the operation and reliability of the device.

Table 3

Symbol

Description

Min

Max

Units

Conditions

VDD

Supply voltage

-0.3

4

V

Note A

VCLK, VDIO, VALRT#

-0.3

1.35

V

AVSEN, BVSEN, CVSEN

-0.3

3.7

V

Do not exceed VDD + 0.2V

AVREF, BVREF, CVREF

-0.3

0.5

V

ISENx, IREFx

DCR current sense

-0.3

3.7

V

Do not exceed VDD + 0.2V

Integrated current sense

-0.3

2.0

V

VD12

-1

1

mA

Do not drive or load this pin

All other pins

-0.30

4*

V

Note A, Note B

Junction temperature

-40

125

C

Storage temperature

-65

150

C

Lead temperature

300

C

Soldering, 10 seconds

Note A: The absolute maximum VDD supply voltage is 4.0V with the conditions that the junction temperature range is maintained

hours cumulatively over the lifetime of the product.

Note B: *The lesser of 4V or VDD+0.2V; outputs in Hi-Z state

Recommended Operating Conditions

Table 4

Symbol

Description

Min

Nom

Max

Units

Notes

VDD

Supply voltage

+3.0

+3.3

+3.6

V

Ambient temperature range

-5

25

85

C

Applicable to “PX…CDM” and

“PX…CDN” devices only

Junction temperature

-40

25

125

C

Applicable to “PX…CPM” and

“PX…CPN” devices only

Table 5: Temperature Information

Symbol

Description

6mm x 6mm QFN

5mm x 5mm QFN

Junction-to-ambient thermal resistance at 0 lfm

30.3

C/W

28.4

C/W

Junction-to-ambient thermal resistance at 200 lfm

26.2

C/W

25.1

C/W

Junction-to-ambient thermal resistance at 500 lfm

23.4

C/W

22.8

C/W

Junction-to-case thermal resistance

2.8

C/W

2.8

C/W