| 전자부품 데이터시트 검색엔진 |
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GPIO66 데이터시트(PDF) 55 Page - Microchip Technology |
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GPIO66 데이터시트(HTML) 55 Page - Microchip Technology |
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55 / 60 page ![]() 2016-2018 Microchip Technology Inc. DS00002236D-page 55 USB5806 FIGURE 10-3: 100-VQFN PACKAGE (LAND PATTERN) RECOMMENDED LAND PATTERN Dimension Limits Units C2 Optional Center Pad Width Contact Pad Spacing Optional Center Pad Length Contact Pitch Y2 X2 8.10 8.10 MILLIMETERS 0.40 BSC MIN E MAX 11.70 Contact Pad Length (X100) Contact Pad Width (X100) Y1 X1 1.05 0.20 Microchip Technology Drawing C04-2407A NOM SILK SCREEN 1 2 100 C1 C2 E X1 Y1 G1 Y2 X2 C1 Contact Pad Spacing 11.70 Contact Pad to Center Pad (X100) G1 0.20 Thermal Via Diameter V Thermal Via Pitch EV 0.33 1.20 ØV EV EV BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: Dimensioning and tolerancing per ASME Y14.5M For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during reflow process 1. 2. |
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