Epoxy Potting Compound/Adhesive

DP270 Clear and Black

- 4 -

Typical Cured

Properties (continued)

Note: The following technical information and data should be considered representative

or typical only and should not be used for specification purposes.

Corrosion:

Per ASTM D-3482

(35°C/95°F/96% R.H./45V d.c./15 days)

Pass - No copper corrosion

Per 3M Test Method C-708

(45°C/113°F/96% R.H./250V d.c./5 days)

Pass - No copper corrosion

(65°C/149°F/96% R.H./250V d.c./4 days)

Pass - No copper corrosion

Per Mil S-46163

(10 days/50% R.H./23°C/73°F)

Pass - No aluminum, brass or steel

discoloration or corrosion

Solvent Resistance:

(Visual check after immersion in specified solvent at 23°C (73°F)

Acetone

1 Hour

B

1 Month

C

Isopropyl Alcohol

A

B

Freon TF

A

A

Freon TMC

B

C

1,1,1-Trichloroethane

A

C

RMA Flux

A

B

Key: A - Unaffected

B - Slight Attack

C - Moderate/Severe Attack

Typical Adhesive

Performance

Characteristics

Note: The following technical information and data should be considered representative

or typical only and should not be used for specification purposes.

Although 3M™ Scotch-Weld™ Epoxy Potting Compound/Adhesive DP270 and 270

B/A can be used for many potting and encapsulation applications, they can also be used

as adhesives. The following shows typical shear and peel values determined on several

common substrates:

Overlap Shear Adhesion (ASTM D-1002-72)

Curing Conditions

7 days / 73°F (23°C)

Alum. /Alum. (etched)

@-67°F (-55°C)

@73°F (23°C)

@180°F (82°C)

1200-1250 psi

2450-2500 psi

300-350 psi

FR-4 / FR-4 (MEK Wiped)

@73°F (23°C)

1750-1800 psi

Copper / Copper (MEK Wiped)

@73°F (23°C)

1700-1750 psi

90° T-Peel Adhesion (ASTM D-1876-61T)

Alum. /Alum. (etched)

@73°F (23°C)

< 2 piw

Compression Strength (ASTM D-695-68T)

Scotch-Weld epoxy potting compound/adhesive

DP270 Clear and Black

@73°F (23°C)

8100 psi