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Die Size (Unsawn)

1500 x 1050

59 x 41

µm

mils

Minimum Bond Pad Size

104 x 104

4.09 x 4.09

µm

mils

Die Thickness

350 (±20)

13.78 (±0.79)

µm

mils

Top Metal Composition

Al 1%Si 1.1µm

Back Metal Composition

N/A – Bare Si

Analog Temperature Sensor – LM335

Single-supply linear-output temperature sensor in bare die form



Wide temperature range: -40 to +100°C



1% typical accuracy at 25°C



Single-point calibration for high precision



Operates from 450μA to 5mA



<1Ω dynamic impedance



Linear output



Small size for high integration

Rev 1.1

28/04/20

Features:

Supply Formats:

Mechanical Specification



Default – Die in Waffle Pack (400 per tray capacity)



Sawn Wafer on Tape – On request



Unsawn Wafer – On request



Die Thickness <> 350µm(14 Mils) – On request



Assembled into Hermetic Package – On request

The LM335 precision linear-output temperature sensor

is designed for simple calibration and ease of use.

Output is derived from an integrated 2-terminal Zener

with a breakdown voltage directly proportional to

absolute temperature at 10mV/°K. Calibrated at

+25°C, the LM335 has an accuracy of 1°C over a wide

-40°C to 100°C temperature range. With less than 1Ω

dynamic impedance, performance is consistent across

a current range of 450μA to 5mA. The device suits

use as a general purpose sensor where its small size,

low impedance and linear output enables simple circuit

integration.

Description

The following part suffixes apply:



No suffix - MIL-STD-883 /2010B Visual Inspection

For High Reliability versions of this product please see

LM135 and LM135A

For higher precision commercial grade product please see

LM335A

Ordering Information

Die Dimensions in µm (mils)

1500 (59)