DocID034289 Rev 2

11/15

MP23DB01HP

Package information

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6

Package information

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK packages, depending on their level of environmental compliance. ECOPACK

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK is an ST trademark.

Soldering information

The RHLGA (3.5 x 2.65 x 0.98) mm package is also compliant with the RoHS and “Green”

standards and is qualified for soldering heat resistance according to JEDEC J-STD-020.

Figure 6. Recommended soldering profile limits

Table 9. Recommended soldering profile limits

Description

Parameter

Pb free

Average ramp rate

3 °C/sec max

Preheat

Minimum temperature

Maximum temperature

150 °C

200 °C

60 sec to 120 sec

Ramp-up rate

Time maintained above liquidous

temperature

Liquidous temperature

60 sec to 150 sec

217 °C

Peak temperature

260 °C max

Time within 5 °C of actual peak temperature

20 sec to 40 sec

T25 °C to PEAK

RAMP -DOWN

RAMP -UP

ts

PREHEAT

t

L

t

p

CRITICAL ZONE

T

T

SMAX

T

SMIN

TIME

T

P

T

L

30

60

90

120

150

180

210

240

270

300

330

360

390