11 Device and Documentation Support

11.1 Device Support

11.1.1 Device Nomenclature

Texas Instruments, Isolation Glossary

11.2 Documentation Support

11.2.1 Related Documentation

For related documentation, see the following:

• Texas Instruments, ISO72x Digital Isolator Magnetic-Field Immunity application report

• Texas Instruments, AMC3330 Precision, ±1-V Input, Reinforced Isolated Amplifier data sheet

• Texas Instruments, TLVx313-Q1 Low-Power, Rail-to-Rail In/Out, 750-μV Typical Offset, 1-MHz Operational

Amplifier for Cost-Sensitive Systems data sheet

• Texas Instruments, 18-Bit, 1-MSPS Data Acquisition Block (DAQ) Optimized for Lowest Distortion and Noise

reference guide

• Texas Instruments, 18-Bit, 1-MSPS Data Acquisition Block (DAQ) Optimized for Lowest Power reference

guide

11.3 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper

right corner, click on Alert me to register and receive a weekly digest of any product information that has

changed. For change details, review the revision history included in any revised document.

11.4 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight

from the experts. Search existing answers or ask your own question to get the quick design help you need.

Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do

not necessarily reflect TI's views; see TI's Terms of Use.

11.5 Trademarks

All other trademarks are the property of their respective owners.

11.6 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

11.7 Glossary

TI Glossary

This glossary lists and explains terms, acronyms, and definitions.

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

www.ti.com

AMC3301-Q1

SBASA73 – JULY 2020

Copyright © 2020 Texas Instruments Incorporated

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Product Folder Links: AMC3301-Q1