SLIC Products

5

ABSOLUTE MAXIMUM RATINGS

Storage temperature . . . . . . . . . . . . –55

°C to +150°C

BGND with respect to

AGND/DGND. . . . . . . . . . . . . . . .+1.0 V to –3.0 V

A(TIP) or B(RING) to BGND:

Continuous . . . . . . . . . . . . . . . . . –70 V to +1.0 V

10 ms (f = 0.1 Hz) . . . . . . . . . . . . –70 V to +5.0 V

1

µs (f = 0.1 Hz). . . . . . . . . . . . . . .–90 V to +10 V

250 ns (f = 0.1 Hz) . . . . . . . . . . . .–120 V to +15 V

Current from A(TIP) or B(RING). . . . . . . . . .

±150 mA

Current through relay drivers . . . . . . . . . . . . . . 60 mA

Current into ring-trip inputs . . . . . . . . . . . . . .

±10 mA

Peak current into regulator switch (L pin) . . . 150 mA

Switcher transient peak off voltage on L pin . . +1.0 V

C4–C1, E1, CHCLK to

In 32-pin PLCC package . . . . . . . . . . . . . 1.74 W

Note: Thermal limiting circuitry on chip will shut down the

circuit at a junction temperature of about 165

°C. The device

should never be exposed to this temperature. Operation

above 145

°C junction temperature may degrade device

reliability. See the SLIC Packaging Considerations for more

information.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent device failure. Functionality at or above

these limits is not implied. Exposure to Absolute Maximum

Ratings for extended periods may affect device reliability.

OPERATING RANGES

Commercial (C) Devices

Ambient temperature . . . . . . . . . . . . . . 0

°C to +70°C*

AGND/DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 V

BGND with respect to

AGND/DGND . . . . . . . . . . . –100 mV to +100 mV

Load resistance on VTX to ground . . . . . . . 10 k

Ω min

Operating Ranges define those limits between which the

functionality of the device is guaranteed.

* Functionality of the device from 0

°C to +70°C is guaranteed

by production testing. Performance from

°C to +85°C is

guaranteed by characterization and periodic sampling of

production units.