Copyright © Future Technology Devices International Limited

33

FT232R USB UART IC Datasheet

Version 2.16

Document No.: FT_000053 Clearance No.: FTDI# 38

9.3 Solder Reflow Profile

The FT232R is supplied in Pb free 28 LD SSOP and QFN-32 packages. The recommended solder reflow

profile for both package options is shown in Figure 9.3.

Figure 9.3 FT232R Solder Reflow Profile

The recommended values for the solder reflow profile are detailed in Table 9.1. Values are shown for both

a completely Pb free solder process (i.e. the FT232R is used with Pb free solder), and for a non-Pb free

solder process (i.e. the FT232R is used with non-Pb free solder).

Profile Feature

Pb Free Solder

Process

Non-Pb Free Solder Process

3°C / second Max.

3°C / Second Max.

Preheat

150°C

200°C

60 to 120 seconds

100°C

150°C

60 to 120 seconds

Time Maintained Above Critical

217°C

60 to 150 seconds

183°C

60 to 150 seconds

260°C

240°C

Time within 5°C of actual Peak

20 to 40 seconds

20 to 40 seconds

Ramp Down Rate

6°C / second Max.

6°C / second Max.

Time for T= 25°C to Peak

8 minutes Max.

6 minutes Max.

Table 9.1 Reflow Profile Parameter Values

Critical Zone: when

T is in the range

T to T

Time, t (seconds)

25

P

T = 25º C to T

t

Preheat

S

t

L

Ramp Up

L

p

Ramp

Down

T Max

S

T Min

S