| 전자부품 데이터시트 검색엔진 |
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EXPRESS-CF 데이터시트(PDF) 3 Page - Adlink Technology Inc. |
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EXPRESS-CF 데이터시트(HTML) 3 Page - Adlink Technology Inc. |
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3 / 4 page ![]() Functional Diagram Mobile New Gen Intel® Xeon® Intel® Core™ Processor Thermal Sensor TPM 2.0 Mobile Intel® QM370/HM370/ CM246 Chipset GPIO GP I2C SPI 0 BIOS LPC bus PCIe x16 (Gen3) 1 x16, 2 x8, or 1 x8 + 2 x4 SPI HD Audio 4x SATA 6Gb/s (port 0/1/2/3) 8x USB 2.0 4x USB 3.1 (port 0/1/2/3) UART0/1 SPI 1 BIOS DDC I2C SODIMM 2 2133/2400 MHz 4-16 GB DDR4 2x PCIe x1 (Gen3) (port 6/7) SPI_CS# DDI 1 DP/HDMI/DVI DDI 2 DP/HDMI/DVI DDI 3 DP/HDMI/DVI single/dual 18/24 bit LVDS 6x PCIex1 (Gen3) (port 0-5) New SEMA BMC PCIe x1 eDP - LVDS LAN I219 LM/V No GbE_SDP XDP 60 SMBus 4x GPO, 4x GPI SMBus LPC to UART SODIMM 1 2133/2400 MHz 4-16 GB DDR4 SODIMM 3 2133/2400 MHz 4-16 GB DDR4 Supports Intel® Optane™ Technology & RST on PCIe ports 0-7 SDIO (for SD card) MUX GPIO SD eDP x2 eDP x2 AUX eDP x4 eDP - VGA |
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