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NRF24AP2-USBQ32-R7 데이터시트(PDF) 39 Page - List of Unclassifed Manufacturers |
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NRF24AP2-USBQ32-R7 데이터시트(HTML) 39 Page - List of Unclassifed Manufacturers |
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39 / 44 page ![]() Revision 1.0 Page 39 of 44 nRF24AP2-USB Product Specification 11 Reference circuitry To ensure optimal performance it is essential that you follow the schematics- and layout references closely. Especially in the case of the antenna matching circuitry (components between device pins ANT1, ANT2, VDD_PA and the antenna), any changes in the layout can change the behavior, resulting in degradation of RF performance or a need to change component values. All the reference circuits are designed for use with a 50Ω single end antenna. 11.1 PCB guidelines A well designed PCB is necessary to achieve good RF performance. A poor layout can lead to loss in performance or functionality. A fully qualified RF-layout for the nRF24AP2 and its surrounding compo- nents, including matching networks, can be downloaded from www.nordicsemi.com. A PCB with a minimum of two layers including a ground plane is recommended for optimal performance. The nRF24AP2 DC supply voltage should be decoupled as close as possible to the VDD pins with high performance RF capacitors. See the schematics in section 11.2 on page 40 for recommended decoupling capacitor values. The nRF24AP2 supply voltage should be filtered and routed separately from the supply voltages of any digital circuitry. Long power supply lines on the PCB should be avoided. All device grounds, VDD connections and VDD bypass capacitors must be connected as close as possible to the nRF24AP2 IC. For a PCB with a topside RF ground plane, the VSS pins should be connected directly to the ground plane. For a PCB with a bottom ground plane, the best technique is to have Via holes as close as possible to the VSS pads. A minimum of one Via hole should be used for each VSS pin. Full-swing digital data or control signals should not be routed close to the crystal or the power supply lines. |
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