Data Sheet

ADGS1414D

Rev. 0 | Page 23 of 28

APPLICATIONS INFORMATION

SYSTEM CHANNEL DENSITY

The ADGS1414D feature set allows for large system channel

density. These features include route through pins for the

digital signals and power supplies, as well as integrated passive

components.

Route Through Pins

When multiple ADGS1414D devices are used in a system, the

route through pins allow for a greater channel density layout.

The route through pins enable the passing of power supplies

and GND power lines, as well as the SCLK, CS, SDI, and SDO

digital lines, are available on both the top and bottom pins of

the package. These route through pins simplify PCB routing

and reduce the need for vias when connecting many

ADGS1414D devices together. Figure 45 shows an example

layout where the route through pins on four ADGS1414D

devices configured in daisy-chain mode are used to reduce the

overall size of the layout.

Integrated Passive Components

Note the lack of external passive components in the layout in

Figure 45. The ADGS1414D has integrated decoupling

Therefore, the need for external decoupling capacitors is

eliminated, reducing the total system footprint of the

ADGS1414D. If additional decoupling is required for extremely

noise sensitive applications, add an external decoupling

capacitor. Figure 21 shows the AC PSRR performance with and

without external decoupling capacitors.

Figure 45. Layout Example Showing the Use of the Route Pins and the Elimination of External Passive Components

GND

SDO

SCLK

CS

GND

SDO

SCLK

CS