| 전자부품 데이터시트 검색엔진 |
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LM90 데이터시트(PDF) 6 Page - National Semiconductor (TI) |
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LM90 데이터시트(HTML) 6 Page - National Semiconductor (TI) |
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6 / 20 page ![]() SMBus DIGITAL SWITCHING CHARACTERISTICS Unless otherwise noted, these specifications apply for V DD=+3.0 Vdc to +3.6 Vdc, CL (load capacitance) on output lines = 80 pF. Boldface limits apply for T A =TJ =TMIN to TMAX; all other limits TA =TJ = +25˚C, unless otherwise noted. The switching characteristics of the LM90 fully meet or exceed the published specifications of the SMBus version 2.0. The fol- lowing parameters are the timing relationships between SMBCLK and SMBData signals related to the LM90. They adhere to but are not necessarily the SMBus bus specifications. Symbol Parameter Conditions Typical Limits Units (Note 6) (Note 7) (Limit) t SU;STA SMBus Repeated Start-Condition Setup Time, SMBCLK High to SMBData Low 0.6 µs (min) t BUF SMBus Free Time Between Stop and Start Conditions 1.3 µs (min) SMBus Communication 20033740 Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not apply when operating the device beyond its rated operating conditions. Note 2: When the input voltage (VI) at any pin exceeds the power supplies (VI < GND or VI > VDD), the current at that pin should be limited to 5 mA. Parasitic components and or ESD protection circuitry are shown in the figure below for the LM90’s pins. The nominal breakdown voltage of D3 is 6.5 V. Care should be taken not to forward bias the parasitic diode, D1, present on pins: D+, D−. Doing so by more than 50 mV may corrupt a temperature measurements. Pin Name PIN # D1 D2 D3 D4 D5 D6 D7 R1 SNP ESD CLAMP V DD 1 x D+ 2 x x xxx x D− 3 x x xxx x T_CRIT_A 4x x x ALERT 6x x x SMBData 7 x x x SMBCLK 8 x Note: An “x” indicates that the diode exists. Note 3: See the URL ”http://www.national.com/packaging/“ for other recommendations and methods of soldering surface mount devices. Note 4: Human body model, 100pF discharged through a 1.5k Ω resistor. Machine model, 200pF discharged directly into each pin. Note 5: Thermal resistance junction-to-ambient when attached to a printed circuit board with 2 oz. foil: – MSOP-8 = 210˚C/W Note 6: Typicals are at TA = 25˚C and represent most likely parametric norm. 20033713 FIGURE 1. ESD Protection Input Structure www.national.com 6 |
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