MPXV7002

Sensors

NXP B.V.

5

3

On-Chip Temperature Compensation, Calibration and Signal

Conditioning

The performance over temperature is achieved by integrating the shear-stress strain gauge, temperature compensation,

calibration and signal conditioning circuitry onto a single monolithic chip.

Figure 2 illustrates the Differential or Gauge configuration in the basic chip carrier (Case 482). A gel die coat isolates the die

surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm.

The MPXV7002 series pressure sensor operating characteristics, and internal reliability and qualification tests are based on use

of dry air as the pressure media. Media, other than dry air, may have adverse effects on sensor performance and long-term

reliability. Contact the factory for information regarding media compatibility in your application.

Figure 3 shows the recommended decoupling circuit for interfacing the integrated sensor to the A/D input of a microprocessor or

microcontroller. Proper decoupling of the power supply is recommended.

Figure 4 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output curves are shown for

operation over a temperature range of 10

° to 60°C using the decoupling circuit shown in Figure 3. The output will saturate outside

of the specified pressure range.

Figure 2. Cross-Sectional Diagram SOP

(not to scale)

Figure 3. Recommended Power Supply Decoupling and Output Filtering

(For additional output filtering, please refer to Application Note AN1646.)

Fluoro Silicone

Gel Die Coat

Wire Bond

Die

P1

Stainless

Steel Cap

Thermoplastic

Case

Die Bond

Differential Sensing

Element

P2

Lead

Frame

+5 V

1.0

μF

0.01

μF

470 pF

GND

IPS

OUTPUT