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STM8S003F3 데이터시트(PDF) 91 Page - STMicroelectronics |
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STM8S003F3 데이터시트(HTML) 91 Page - STMicroelectronics |
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91 / 103 page ![]() DS7147 Rev 10 91/103 STM8S003F3 STM8S003K3 Package information 97 10.2 TSSOP20 package information Figure 47. TSSOP20 – 20-lead thin shrink small outline, 6.5 x 4.4 mm, 0.65 mm pitch, package outline 1. Drawing is not to scale. Table 53. TSSOP20 – 20-lead thin shrink small outline, 6.5 x 4.4 mm, 0.65 mm pitch, package mechanical data Symbol millimeters inches(1) 1. Values in inches are converted from mm and rounded to four decimal digits. Min. Typ. Max. Min. Typ. Max. A - - 1.200 - - 0.0472 A1 0.050 - 0.150 0.0020 - 0.0059 A2 0.800 1.000 1.050 0.0315 0.0394 0.0413 b 0.190 - 0.300 0.0075 - 0.0118 c 0.090 - 0.200 0.0035 - 0.0079 D(2) 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed 0.15mm per side. 6.400 6.500 6.600 0.2520 0.2559 0.2598 E 6.200 6.400 6.600 0.2441 0.2520 0.2598 E1(3) 3. Dimension "E1" does not include interlead Flash or protrusions. Interlead Flash or protrusions shall not exceed 0.25mm per side. 4.300 4.400 4.500 0.1693 0.1732 0.1772 e - 0.650 - - 0.0256 - L 0.450 0.600 0.750 0.0177 0.0236 0.0295 L1 - 1.000 - - 0.0394 - k 0° - 8° 0° - 8° aaa - - 0.100 - - 0.0039 YA_ME_V3 1 20 C c L E E1 D A2 A k e b 10 11 A1 L1 aaa SEATING PLANE C GAUGE PLANE 0.25 mm PIN 1 IDENTIFICATION |
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