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STM32H747AI 데이터시트(PDF) 234 Page - STMicroelectronics |
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STM32H747AI 데이터시트(HTML) 234 Page - STMicroelectronics |
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234 / 252 page ![]() Package information STM32H747xI/G 224/242 DS12930 Rev 1 Device marking for WLSCP156 The following figure gives an example of topside marking versus pin 1 position identifier location. The printed markings may differ depending on the supply chain. Other optional marking or inset/upset marks, which depend on supply chain operations, are not indicated below. Figure 74. WLCSP156 marking example (package top view) 1. Parts marked as “ES”, “E” or accompanied by an Engineering Sample notification letter, are not yet qualified and therefore not approved for use in production. ST is not responsible for any consequences resulting from such use. In no event will ST be liable for the customer using any of these engineering samples in production. ST’s Quality department must be contacted prior to any decision to use these engineering samples to run a qualification activity. Table 132. WLCSP156 bump recommended PCB design rules Dimension Recommended values Pitch 0.35 mm Dpad 0.210 mm Dsm 0.275 mm typ. (depends on the soldermask registration tolerance) Stencil opening 0.235 mm Stencil thickness 0.100 mm MSv61385V1 Revision code Ball A1 identifier Product identification(1) Date code ES32H747ZI6 WW Y R |
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