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STM32H747AI 데이터시트(PDF) 232 Page - STMicroelectronics

부품명 STM32H747AI
상세설명  Dual 32-bit Arm® Cortex®-M7 up to 480MHz and -M4 MCUs, up to 2MB Flash, 1MB RAM, 46 com. and analog interfaces, SMPS, DSI
PDF  252 Pages
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제조업체  STMICROELECTRONICS [STMicroelectronics]
홈페이지  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32H747AI 데이터시트(HTML) 232 Page - STMicroelectronics

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Package information
STM32H747xI/G
222/242
DS12930 Rev 1
7
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at www.st.com.
ECOPACK® is an ST trademark.
7.1
WLCSP156 package information
WLCSP156 is a 156-bump, 4.96 x 4.64 mm, 0.35 mm pitch, wafer level chip scale
package.
Figure 72. WLCSP156 package outline
1. Drawing is not to scale.
A086_WLCSP156_ME_V1
e
e
D
E
e2
e1
G
F
A1 ball location
D
E
BOTTOM VIEW
TOP VIEW
A3
b
A2
A2
A
A1
bbb
Z
Detail A
A1
ccc
Z
Z
ZX Y
ddd
DETAIL A
ROTATED 90
SEATING
PLANE
FRONT VIEW
SIDE
VIEW
BUMP



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