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STM32G474PBY6XXX 데이터시트(PDF) 84 Page - STMicroelectronics |
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STM32G474PBY6XXX 데이터시트(HTML) 84 Page - STMicroelectronics |
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84 / 236 page ![]() Electrical characteristics STM32G474xB STM32G474xC STM32G474xE 84/236 DS12288 Rev 5 5.3 Operating conditions 5.3.1 General operating conditions Table 17. General operating conditions Symbol Parameter Conditions Min Max Unit fHCLK Internal AHB clock frequency - 0 170 MHz fPCLK1 Internal APB1 clock frequency - 0 170 fPCLK2 Internal APB2 clock frequency - 0 170 VDD Standard operating voltage - 1.71(1) 3.6 V VDDA Analog supply voltage ADC 1.62 3.6 V DAC 1 MSPS or DAC 15 MSPS or OPAMP 1.8 COMP used 1.8 3.6 VREFBUF used 2.4 3.6 ADC, DAC, OPAMP, COMP, VREFBUF not used 0 VBAT Backup operating voltage - 1.55 3.6 V VIN I/O input voltage TT_xx -0.3 VDD+0.3 V FT_c -0.3 5 All I/O except TT_xx and FT_c -0.3 MIN(MIN(VDD, VDDA)+3.6 V, 5.5 V)(2)(3) PD Power dissipation See Section 6.10: Thermal characteristics for application appropriate thermal resistance and package. Power dissipation is then calculated according ambient temperature (TA) and maximum junction temperature (TJ) and selected thermal resistance. mW PD Power dissipation See Section 6.10: Thermal characteristics for application appropriate thermal resistance and package. Power dissipation is then calculated according to ambient temperature (TA), maximum junction temperature (TJ) and selected thermal resistance. mW TA Ambient temperature for the suffix 6 version Maximum power dissipation -40 85 °C Low-power dissipation(4) -40 105 Ambient temperature for the suffix 3 version Maximum power dissipation -40 125 Low-power dissipation(4) -40 130 TJ Junction temperature range Suffix 6 version -40 105 °C Suffix 3 version -40 130 1. When RESET is released functionality is guaranteed down to VBOR0 Min. 2. This formula has to be applied only on the power supplies related to the IO structure described by the pin definition table. Maximum I/O input voltage is the smallest value between MIN(VDD, VDDA)+3.6 V and 5.5V. |
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