VS6650S02FSLASHT2 datasheet(1/3 Pages) STMICROELECTRONICS

부품명	VS6650S02F/T2

상세설명	1.0 Megapixel SMIA Camera Module

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제조업체	STMICROELECTRONICS [STMicroelectronics]

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DATA BRIEF

October 2004

VS6650

1.0 Megapixel SMIA Camera Module

Rev. 1

FEATURES

■ 1.0 Megapixel resolution (1152H x 864V)

■ SMIA

1 1.0 profile 1 compliant imager

■ CCP 2.0 serial video interface

■ Two-wire control port (CCI)

■ On-chip PLL based on 13 MHz system clock

■ Up to 30 frame per second (fps) progressive

scan, with smooth frame rate control

■ Horizontal downscale from 1x to 4.5x in 1/16

steps

■ Operation from 2.4 V analog power supply

■ Low EMI 1.8 V digital and I/O power supply

■ 30 µW power-down consumption

■ 10-bit on-chip ADC

■ Small size 1/3 inch lens fixed focus module

■ Integral EMC shielding

DESCRIPTION

The VS6650 is a 1.0 Megapixel camera module for

use across a range of mobile phone platforms.

The camera module, which is SMIA 1.0 profile 1

compliant, can generate 1.0 Megapixel images up

to 30 fps.

Based on the SMIA architectural concepts, the

VS6650 can be used with or without image pro-

cessor (i.e. STV0976 or STV0984). The module is

suitable for performance-driven camera phones

and cost-driven high volume designs. The embed-

ded horizontal scaler typically enables the realiza-

tion of power-efficient viewfinder that uses host

software processing. For performance driven ap-

plications or when a different video interface is re-

quired, the STV0976 mobile imaging processor

ensures state-of-the-art image reconstruction and

compression at up to 15 fps.

The VS6650 features allow straightforward inte-

gration into mobile phone designs: low EMI video

interface and package/socket shielding, low wire

count (8 total), embedded power management (30

µW power-down) and embedded PLL. A minimal

list of external components is required: supply de-

coupling capacitors, CCI pull-ups and a charge-

pump capacitor.

The VS6650 3-element lens design ensures high

quality image capture while maintaining low mod-

ule height. The overall optical stack, including lens

system, IR filter and sensor optical structures is

developed within ST.

The VS6650 package uses the second generation

of SmOP2 packaging technology. Sensor and lens

are assembled in a fully automated test and focus

process for high volume and low cost production.

This 1.0 Megapixel sensor fits within the SMIA95

form factor (9.5 x 9.5 x 7.6 mm3).

APPLICATIONS

■ Mobile phone

■ PDA

■ Wireless security camera

Table 1. Order Codes

1.Standard Mobile Imaging Architecture, visit

www.smia-forum.org

Part Number

Description

VS6650S02F/T2

SmOP2 SMIA95 22” tape and reel

유사한 부품 번호 - VS6650S02F/T2

제조업체	부품명	데이터시트	상세설명
Marktech Corporate	VS665N	66Kb / 1P	Visible Light Emitting Diode

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제조업체	부품명	데이터시트	상세설명
STMicroelectronics	STV0976	41Kb / 3P	1.0 Megapixel SMIA Processor Oct-2004
	VS6750	48Kb / 3P	2 Megapixel SMIA Camera Module 21-Sep-2005
	VS6590	58Kb / 3P	0.5 Megapixel Camera Module Oct-2004
	VS6624	1,017Kb / 100P	1.3 Megapixel Mobile Camera Module 01-Feb-2006
	VS6724	1Mb / 118P	2 Megapixel single-chip camera module 03-Jul-2007
	VS6663	1Mb / 64P	1.3 megapixel camera module 03-Jul-2015
	VS6663CB	950Kb / 64P	1.3 megapixel camera module 01-Jul-2015
	VS6663CC	1Mb / 63P	1.3 megapixel camera module 19-Oct-2015
	VS6663CD	1Mb / 64P	1.3 megapixel camera module 09-Sep-2015
	VX6953CB	3Mb / 107P	5.1 megapixel EDOF camera module 05-Mar-2013

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VS6650S02F/T2 데이터시트(HTML) 1 Page - STMicroelectronics

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