© 2018 Integrated Device Technology, Inc.

6

Rev O May 11, 2018

F1421 Datasheet

Thermal Characteristics

Table 5.

Package Thermal Characteristics

Parameter

Symbol

Value

Units

Junction to Ambient Thermal Resistance

45

°C/W

Junction to Case Thermal Resistance

(Case is defined as the exposed paddle)

36

°C/W

Moisture Sensitivity Rating (Per J-STD-020)

MSL 1

Typical Operating Conditions (TOC)











STBY = LOW (0V)





5MHz Tone Spacing



Evaluation Kit traces and connector losses are de-embedded