FSV1060V datasheet(2/6 Pages) ONSEMI

2 / 6 page

FSV1060V

www.onsemi.com

Specifications

ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted) (Note 1)

Symbol

Parameter

Value

Unit

VRRM

Peak Repetitive Reverse Voltage

VRWM

Working Peak Reverse Voltage

VRMS

RMS Reverse Voltage

DC Blocking Voltage

Average Rectified Output Current at TL = 90°C (Note 2)

IFSM

Non−Repetitive Peak Forward Surge Current (Note 3)

280

Typical Junction Capacitance, VR = 4 V, 1 MHz

550

Operating Junction Temperature Range

−55 to +150

°C

TSTG

Storage Temperature Range

−55 to +150

°C

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.

1. All test conducted at TA = TJ = 25°C unless otherwise noted.

2. Mounted on 30 mm x 30 mm FR4 PCB.

3. Pulse condition: 8.3 ms single half−sine wave. Test method is compliant with MIL standard (MIL−STD−750E).

THERMAL CHARACTERISTICS (TA = 25°C unless otherwise noted) (Note 4)

Symbol

Characteristic

Minimum Land

Pattern

Maximum Land

Pattern

Unit

RqJA

Junction−to−Ambient Thermal Resistance

105

°C/W

ΨJL

Junction−to−Lead Thermal Characteristics,

Thermocouple Soldered to Anode

°C/W

Junction−to−Lead Thermal Characteristics,

Thermocouple Soldered to Cathode

4. The thermal resistances (RqJA & ΨJL) are characterized with device mounted on the following FR4 printed circuit boards, as shown in Figure 1

and Figure 2. PCB size: 76.2 x 114.3 mm. Minimum land pattern size: 4.9 x 4.8 mm (big pattern, x1), 1.4 x 1.52 mm (small pattern, x2).

Maximum land pattern size: 30 x 30 mm (pattern, x2). Force line trace size = 55 mils, sense line trace size = 4 mils.

Figure 1. Minimum Land Pattern of 2 oz Copper

Figure 2. Maximum Land Pattern of 2 oz Copper

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