LTM8051

27

Rev. 0

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Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications

subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices.

PACKAGE DESCRIPTION

N

M

L

K

J

H

G

F

E

D

C

B

A

1

2

3

4

5

6

7

PACKAGE TOP VIEW

4

PIN “A1”

CORNER

Y

X

aaa Z

DETAIL A

PACKAGE BOTTOM VIEW

3

SEE NOTES

PIN 1

BGA Package

91-Lead (11.25mm

× 6.25mm × 2.22mm)

(Reference LTC DWG# 05-08-1608 Rev Ø)

BGA 91 0118 REV Ø

TRAY PIN 1

BEVEL

PACKAGE IN TRAY LOADING ORIENTATION

COMPONENT

PIN “A1”

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994

2. ALL DIMENSIONS ARE IN MILLIMETERS

BALL DESIGNATION PER JEP95

4

3

DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL,

BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.

THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR

MARKED FEATURE

DETAIL A

Øb (91 PLACES)

A

DETAIL B

PACKAGE SIDE VIEW

M

X Y

Z

ddd

M Z

eee

A2

D

E

e

e

b

F

G

SUGGESTED PCB LAYOUT

TOP VIEW

0.000

2.400

4.000

3.200

4.800

4.000

4.800

1.600

0.800

2.400

1.600

3.200

0.800

LTMXXXXXX

µModule

b

0.400 ±0.025 Ø 91x

6

SEE NOTES

5. PRIMARY DATUM -Z- IS SEATING PLANE

6

PACKAGE ROW AND COLUMN LABELING MAY VARY

AMONG µModule PRODUCTS. REVIEW EACH PACKAGE

LAYOUT CAREFULLY

!

DETAIL B

SUBSTRATE

A1

ccc Z

H2

H1

MOLD

CAP

SYMBOL

A

A1

A2

b

b1

D

E

e

F

G

H1

H2

aaa

bbb

ccc

ddd

eee

MIN

2.03

0.30

1.73

0.45

0.37

NOM

2.22

0.40

1.82

0.50

0.40

11.25

6.25

0.80

9.60

4.80

0.32

1.50

MAX

2.41

0.50

1.91

0.55

0.43

0.15

0.10

0.20

0.15

0.08

TOTAL NUMBER OF BALLS: 91

DIMENSIONS

NOTES

BALL HT

BALL DIMENSION

PAD DIMENSION

SUBSTRATE THK

MOLD CAP HT

b1

aaa Z

2×

2×