Absolute Maximum Ratings

SUP ........................................................................ -0.3V to +40V

EN........................................................................... -0.3V to +40V

BST to LX (Note 1) ................................................................. +6V

BST......................................................................... -0.3V to +45V

OUT ........................................................................ -0.3V to +18V

PGOOD .................................................................... -0.3V to +6V

PGND to AGND..................................................... -0.3V to +0.3V

BIAS ...................................................................... -0.3V to +6.0V

LX Continuous RMS Current ....................................................3A

OUT Short-Circuit Duration...........................................................

ESD Protection Human Body Model.....................................±2kV

Machine Model....................................................................±200V

(derate 24.4mW/°C above +70°C) ..................................1951mW

Storage Temperature Range ..............................-65ºC to +150ºC

Operating Junction Temperature (Note 6) ..........-40ºC to +150ºC

Lead Temperature (Soldering, 10s) .................................. +300ºC

Soldering Temperature (Reflow)....................................... +260ºC

Note 1: LX has internal clamp diodes to PGND/AGND and SUP. Applications that forward bias these diodes should take care not to

exceed the IC’s package power-dissipation limits.

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the

device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for

extended periods may affect device reliability.

Package Information

12 TDFN

Package Code

TD1233+2C

Outline Number

21-0664

Land Pattern Number

90-0397

THERMAL RESISTANCE, FOUR-LAYER BOARD

41°C/W

9°C/W

For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages.

Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different

suffix character, but the drawing pertains to the package regardless of RoHS status.

Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a

four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/

thermal-tutorial.

Electrical Characteristics

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

Supply Voltage Range

3.5

36

V

After Start-Up

3

36

t < 1s

40

MAX25232

www.maximintegrated.com

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