7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

Supply voltage

48

V

–0.3

48

V

–48

0.3

V

Source input pin (Sx) voltage to GND

–65

65

V

–90

V

90

V

Drain pin (Dx) voltage

V

Logic control input pin voltage (SELx)(2)

GND –0.7

48

V

Digital output pin voltage (FF)

GND –0.7

6

V

Logic control input pin current (SELx)(2)

–30

30

mA

Digital output pin current (FF)

–30

30

mA

Source or drain continuous current (Sx or Dx)

mA

Storage temperature

–65

150

°C

Ambient temperature

–55

150

°C

Junction temperature

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under

Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

(2)

Stresses have to be kept at or below both voltage and current ratings at all time.

(3)

7.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/

JEDEC JS-001, all pins(1)

±2000

V

Charged device model (CDM), per JEDEC

specification JESD22-C101, all pins(2)

±500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Thermal Information

THERMAL METRIC(1)

TMUX7411F/ TMUX7412F/

TMUX7413F

UNIT

PW (TSSOP)

RRP (WQFN)

16 PINS

16 PINS

Junction-to-ambient thermal resistance

TBD

42.8

°C/W

Junction-to-case (top) thermal resistance

TBD

28.5

°C/W

Junction-to-board thermal resistance

TBD

17.9

°C/W

Junction-to-top characterization parameter

TBD

0.3

°C/W

Junction-to-board characterization parameter

TBD

17.9

°C/W

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TMUX7411F, TMUX7412F, TMUX7413F

SCDS404 – MARCH 2021

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