STw4141

4 Application information

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4.7.2

TFBGA16 internal bumps access

Pad centers are at 500 µm distance. Pad diameter is 275 µm. The distance between two

adjacent pad edges is only 225 µm. We recommend a distance for lead-out signals from the

center of pad matrix by 75 µm wide trace. Isolation distance in this case is 75 µm (see

Figure 18 and Figure 19).

Figure 18. TFBGA16 ball pad spacing and track parameters to internal pads

Figure 19. PCB routing example using TFBGA16

Grid dot distance :

with

A = 500

µm

B = 275

µm

C = 75

µm