RF6100-4PCBA datasheet(4/6 Pages) RFMD

4 / 6 page

2-4

RF6100-4

Rev A0 031217

Function

Description

Interface Schematic

1VCC1

First stage collector supply. A low frequency decoupling capacitor

(e.g., 4.7

µF) may be required.

2RF IN

RF input internally matched to 50

Ω. This input is internally AC-coupled.

3GND

Ground connection. Connect to package base ground. For best perfor-

mance, keep traces physically short and connect immediately to

ground plane.

4VMODE

For nominal operation (High Power Mode), VMODE is set LOW. When

set HIGH, devices are biased lower to improve efficiency.

5VREG

Regulated voltage supply for amplifier bias. In Power Down mode, both

VREG and VMODE need to be LOW (<0.5V).

6GND

Ground connection. Connect to package base ground. For best perfor-

mance, keep traces physically short and connect immediately to

ground plane.

7GND

Ground connection. Connect to package base ground. For best perfor-

mance, keep traces physically short and connect immediately to

ground plane.

8RF OUT

RF Output internally matched to 50

Ω. This output is internally

AC-coupled.

9GND

Ground connection. Connect to package base ground. For best perfor-

mance, keep traces physically short and connect immediately to

ground plane.

VCC2

Output stage collector supply. A low frequency decoupling capacitor

(e.g., 4.7

µF) is required.

Pkg

Base

GND

Ground connection. The backside of the package should be soldered to

a top side ground pad which is connected to the ground plane with mul-

tiple vias. The pad should have a short thermal path to the ground

plane.

RF6100-4PCBA 데이터시트(PDF) 4 Page - RF Micro Devices

RF6100-4PCBA 데이터시트(HTML) 4 Page - RF Micro Devices

Html Pages

1 2 3 4 5 6

데이터시트 다운로드

링크 URL