| 전자부품 데이터시트 검색엔진 |
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HM2940 데이터시트(PDF) 4 Page - Shenzhen Huazhimei Semiconductor Co., Ltd |
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HM2940 데이터시트(HTML) 4 Page - Shenzhen Huazhimei Semiconductor Co., Ltd |
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4 / 4 page ![]() SPECIFICATION Table 1. COPPER AREA TOP SIDE* BACK SIDE BOARD AREA THERMAL RESISTANCE (JUNCTION-TO-AMBIENT) 2500 Sq. mm 2500 Sq. mm 2500 Sq. mm 45°C/W 1000 Sq. mm 2500 Sq. mm 2500 Sq. mm 45°C/W 225 Sq. mm 2500 Sq. mm 2500 Sq. mm 53°C/W 100 Sq. mm 2500 Sq. mm 2500 Sq. mm 59°C/W 1000 Sq. mm 1000 Sq. mm 1000 Sq. mm 52°C/W 1000 Sq. mm 0 1000 Sq. mm 55°C/W Ripple Rejection The ripple rejection values are measured with the adjustment pin bypassed. The impedance of the adjust pin capacitor at the ripple frequency should be less than the value of R1 (normally 100Ωto 200Ω) for a proper bypassing and ripple rejection approaching the values shown. The size of the required adjust pin capacitor is a function of the input ripple frequency. If R1=100Ω at 120Hz the adjust pin capacitor should be >13mF. At 10kHz only 0.16mF is needed. The ripple rejection will be a function of output voltage, in circuits without an adjust pin bypass capacitor. The output ripple will increase directly as a ratio of the output voltage to the reference voltage (VOUT / VREF ). PACKAGE DIMENSIONS Inches (millimeters) unless otherwise noted. 3 LEAD SOT-223 PLASTIC PACKAGE Marking: A = SOT223 ; ***** = datacode |
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