Operating Diagrams

Outline Dimensions

Output Specification (@ 25°C, unless otherwise specified)

Heatsink Recommendations

• We recommend that solid state relay modules be mounted to a heatsink sufficient to maintain the module’s base temperature at 85°C

under worst case ambient temperature and load conditions.

• The heatsink mounting surface should be a smooth (30-40 micro-inch finish), flat (30-40 micro-inch flatness across mating area), un-painted surface

which is clean and free of oxidation.

• An even coating of thermal compound (Dow Corning DC340 or equivalent) should be applied to both the heatsink and module mounting surfaces

and spread to a uniform depth of .002” to eliminate all air pockets.

Parameter

Nom. Line Voltage

Conditions

Units

10A Models 16A Models

25A Models

Load Voltage Range V

L

240

Vrms

24-280

480

Vrms

48-480

Load Current Range I

240 & 480

Resistive

A

10

16

25

Single Cycle Surge Current

A

100

160

208

Leakage Current (Off-State) (@rated voltage)

f=60Hz. V

L

=Nom

mA

5

On-State Voltage Drop (@rated current)

I

Vrms

1.6

Static dv/dt (Off-State) (Min.)

V/µs

400

475

Repetitive Peak Off-State Voltage

240

Vrms

600

480

800

240 & 480

55

144

259

Zero Turn-On Voltage

Vpk

15

Thermal Resistance, Junction to case (R

(Max.)

°C/W

2.4

2.1

2

Turn -On Time (Max.)

f= 60/ 50 Hz.

ms

10 for Zero Voltage Turn-On

0.1 for Random Voltage Turn-On

Turn -Off Time (Max.)

10 for Zero Voltage Turn-On

8.3/10 for Random Voltage Turn-On

* See Derating curve

Electrical Characteristics (Thermal Derating Curves)

Solid State Relay

05-2020, Rev. 0520

www.te.com

© 2015 Tyco Electronics Corporation,

a TE Connectivity Ltd. company

Datasheets and product specification

according to IEC 61810-1 and to be used

only together with the ‘Definitions’ section.

Datasheets and product data is subject to the

terms of the disclaimer and all chapters of

the ‘Definitions’ section, available at

http://relays.te.com/definitions

Datasheets, product data, ‘Definitions’ sec-

tion, application notes and all specifications

are subject to change.

2

Potter & Brumfield