Data Sheet

ADMV1009

Rev. B | Page 5 of 23

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

24 NIC

23 NIC

22 NIC

21 NIC

20 NIC

19 LOIN

18 GND

17 NIC

1

2

3

4

5

6

7

8

NIC

PIN1

INDICATOR

GND

RFOUT

NIC

NIC

NIC

VGRF

NIC

TOP VIEW

(Not to Scale)

ADMV1009

NOTES

1. NIC = NOT INTERNALLY CONNECTED. IT IS

RECOMMENDED TO GROUND THESE PINS

ON THE PCB.

2. EXPOSED PAD. EXPOSED PAD MUST BE

CONNECTED TO GND. GOOD RF AND THERMAL

GROUNDING IS RECOMMENDED.

Figure 2. Pin Configuration

Table 4. Pin Function Descriptions

Pin No.

Mnemonic

Description

1, 4 to 6, 8, 9, 12, 13, 16,

17, 20 to 25, 28, 30, 32

NIC

Not Internally Connected. It is recommended to ground these pins on the PCB.

2, 10, 15, 18

GND

Ground. These pins are grounded internally and must also be grounded on the PCB.

3

RFOUT

RF Output. This pin is ac-coupled internally and matched to 50 Ω, single-ended.

7

VGRF

Power Supply Voltage for the Gate of the RF Amplifier. Refer to the Applications Information

section for the required external components and biasing.

11, 14

IF2, IF1

Differential IF Inputs. These pins are matched to 50 Ω and are ac-coupled. No external dc block is

required.

19

LOIN

Local Oscillator Input. This pin is ac-coupled and matched to 50 Ω.

26

VGLO

Power Supply Voltage for the Gate of the LO Amplifier. Refer to the Applications Information

section for the required external components and biasing.

27

VDLO

Power Supply Voltage for the LO Amplifier. Refer to the Applications Information section for the

required external components and biasing.

29

VGMIX

Power Supply Voltage for the Mixer. This pin is a high impedance port. Refer to the Applications

Information section for the required external components and biasing.

31

VDRF

Power Supply Voltage for the RF Amplifier. Refer to the Applications Information section for the

required external components and biasing.

EPAD

Exposed pad. The exposed pad must be connected to GND. Good RF and thermal grounding is

recommended.