STSPIN32F0252 datasheet(9/32 Pages) STMICROELECTRONICS

9 / 32 page

4.2

Thermal data

Table 5. Thermal data

Symbol

Parameter

Value

Unit

Rth(JA)

Thermal resistance junction to ambient(1)

TQFP 10x10 64L package

27.6

°C/W

Thermal resistance junction to ambient (1)

QFN 10x10 72L package

22.4

1. JEDEC 2s2p PCB in still air.

4.3

Recommended operating conditions

Table 6. Recommended operating conditions

Symbol

Parameter

Test Condition

Min

Typ

Max

Unit

VCC

Power supply voltage

(VCCthON)MAX

VLS (1)

Low-side driver supply voltage

VPS (2)

Low-side driver ground

-5

VBO(3)

Floating supply voltage

(VBOthON)MAX

VCIN

Comparator input voltage

VOUT

DC Output voltage

-10(4)

230

FSW

Maximum switching frequency

(5)

800

kHz

VDD

Standard MCU operating

voltage

3.0

3.3

3.6

VDDA

MCU analog operating voltage

(ADC not used)

Must have a potential equal to

or higher than VDD

VDD

3.6

MCU analog operating voltage

(ADC used)

VDD

3.6

Operating junction temperature

-40

125

°C

1. VLS = VCC - VPGND

2. VPS = VPGND - VSGND

3. VBO = VBOOT - VOUT

4. LVG off. VCC = 9 V. Logic is operational if VBOOT > 5 V

5. Actual maximum FSW depends on power dissipation.

STSPIN32F0251, STSPIN32F0252

Thermal data

DS13048 - Rev 4

page 9/32

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