HMC329ALC3BTR-R5 datasheet(4/23 Pages) AD

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HMC329ALC3B

Data Sheet

Rev. 0 | Page 4 of 23

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

RF Input Power

13 dBm

LO Input Power

24 dBm

IF Input Power

13 dBm

IF Source or Sink Current

3 mA

Peak Reflow Temperature

260°C

Maximum Junction Temperature

175°C

Continuous Power Dissipation, PDISS (TA = 85°C,

Derate 3.7 mW/°C Above 85°C)

200 mW

Operating Temperature Range

−55°C to +85°C

Storage Temperature Range

−65°C to +150°C

Lead Temperature (Soldering 60 sec)

260°C

Electrostatic Discharge (ESD) Sensitivity

Human Body Model (HBM)

1500 V, Class 1C

Field-Induced Charged Device Model

(FICDM)

1250 V, Class IV

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to

PCB thermal design is required.

θJA is the natural convection, junction to ambient thermal

resistance measured in a one cubic foot sealed enclosure.

θJC is the junction to case thermal resistance.

Table 3. Thermal Resistance

Package Type

θJA

θJC

Unit

E-12-41

120

445

°C/W

Test Condition 1: JEDEC standard JESD51-2.

ESD CAUTION

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