152CME datasheet(4/8 Pages) VISHAY

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152 CME

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Vishay BCcomponents

Revision: 05-Nov-2019

Document Number: 28459

For technical questions, contact: aluminumcaps1@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

ADVANCED SOLDERING PROFILE FOR LEAD (Pb)-FREE REFLOW PROCESS



ACCORDING TO JEDEC J-STD-020

Fig. 4 - Maximum temperature load during reflow soldering

Table 4

Notes

• Temperature measuring point on top of the case and on terminals

• Max. 2 runs with pause of min. 30 min in between

REFLOW SOLDERING CONDITIONS for MAL215299xxxE3

PROFILE FEATURES

CASE CODE

1010

CASE CODE

1213 TO 1216

CASE CODE

1616 TO 1821

Max. time from 25 °C to TPeak

300 s

Max. ramp-up rate to 150 °C

3 K/s

Max. time from 150 °C to 200 °C (t1)

150 s

Max. time from 190 °C to 200 °C (t2)

110 s

Ramp up rate from 200 °C to TPeak

0.5 K/s to 3 K/s

Max. time above TLiquidus (217 °C) (t3)

90 s

Max. time above 230 °C (t4)

70 s

65 s

60 s

Peak temperature TPeak

260 °C

250 °C

245 °C

Max. time above TPeak minus 5 °C

40 s

30 s

Ramp-down rate from TLiquidus

3 K/s to 6 K/s

200

190

150

217

230

Peak

time (s)

T (°C)

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