| 전자부품 데이터시트 검색엔진 |
|
MCP48FVB28 데이터시트(PDF) 96 Page - Microchip Technology |
|
|
|||||||||||||||||||||||||||||
MCP48FVB28 데이터시트(HTML) 96 Page - Microchip Technology |
|
96 / 112 page ![]() MCP48FXBX4/8 DS20006362A-page 96 2020 Microchip Technology Inc. RECOMMENDED LAND PATTERN Microchip Technology Drawing C04-2139B (MQ) 20-Lead Plastic Quad Flat, No Lead Package (MQ) – 5x5x1.0 mm Body [VQFN] SILK SCREEN 1 2 20 Thermal Via Diameter V Thermal Via Pitch EV 0.30 1.00 BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: Dimensioning and tolerancing per ASME Y14.5M For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during reflow process 1. 2. For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: Dimension Limits Units C1 Optional Center Pad Width Contact Pad Spacing Contact Pad Spacing Optional Center Pad Length Contact Pitch C2 T2 W2 3.35 3.35 MILLIMETERS 0.65 BSC MIN E MAX 4.50 4.50 Contact Pad Length (X20) Contact Pad Width (X20) Y1 X1 0.55 0.40 G Distance Between Pads 0.20 NOM With 0.40 mm Contact Length C1 C2 EV EV E X2 Y2 ØV G Y1 X1 |
|
링크 URL |
| ALLDATASHEET 가 귀하에 도움이 되셨나요? [ DONATE ] |
Alldatasheet는? | 광고문의 | 운영자에게 연락하기 | 개인정보취급방침 | 링크 투 데이터시트 | 링크교환 | 제조사별 검색 All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |