ADPA1107

Data Sheet

Rev. 0 | Page 20 of 20

OUTLINE DIMENSIONS

0.50

BSC

BOTTOM VIEW

TOP VIEW

0.05 MAX

0.02 NOM

0.203 REF

COPLANARITY

0.08

0.30

0.25

0.18

6.10

6.00 SQ

5.90

0.80

0.75

0.70

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

0.45

0.40

0.35

0.20 MIN

4.70

4.60 SQ

4.50

COMPLIANT TO JEDEC STANDARDS MO-220-WJJD-5

40

1

11

10

20

21

30

31

END VIEW

EXPOSED

PAD

P IN 1

IN D IC AT O R AR E A OP T IO N S

(SEE DETAIL A)

DETAIL A

(JEDEC 95)

SEATING

PLANE

PIN 1

INDICATOR

AREA

Figure 54. 40-Lead Lead Frame Chip Scale Package [LFCSP]

6 mm × 6 mm Body and 0.75 mm Package Height

(CP-40-7)

Dimensions shown in millimeters

ORDERING GUIDE

Temperature

Package Option

ADPA1107ACPZN

−40°C to +85°C

MSL3

40-Lead Lead Frame Chip Scale Package [LFCSP]

CP-40-7

ADPA1107ACPZN-R7

−40°C to +85°C

MSL3

40-Lead Lead Frame Chip Scale Package [LFCSP]

CP-40-7

ADPA1107-EVALZ

Evaluation Board

1

The ADPA1107ACPZN and ADPA1107ACPZN-R7 models are RoHS compliant parts.

2

See the Absolute Maximum Ratings section for additional information.

3

The lead finish of ADPA1107ACPZN and ADPA1107ACPZN-R7 is nickel palladium gold (NiPdAu).

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registered trademarks are the property of their respective owners.

D26290-7/21(0)