HMC553ALC3BTR-R5 datasheet(4/25 Pages) AD

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HMC553ALC3B

Data Sheet

Rev. B | Page 4 of 25

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

RF Input Power

25 dBm

LO Input Power

25 dBm

IF Input Power

25 dBm

IF Source/Sink Current

3 mA

Reflow Temperature

260°C

Maximum Junction Temperature

175°C

Continuous Power Dissipation, PDISS

(TA = 85°C, Derate 4.6 mW/°C Above 85°C)

414 mW

Operating Temperature Range

−40°C to +85°C

Storage Temperature Range

−65°C to +150°C

Lead Temperature Range

−65°C to +150°C

Electrostatic Discharge (ESD) Sensitivity

Human Body Model (HBM)

1000 V

Field Induced Charged Device Model

(FICDM)

1250 V

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to PCB design and

operating environment. Careful attention to PCB thermal

design is required.

θJA is the natural convection junction to ambient thermal

resistance measured in a one cubic foot sealed enclosure. θJC is

the junction to case thermal resistance.

Table 3. Thermal Resistance

Package Type

θJA

θJC

Unit

E-12-41

120

175

°C/W

1 See JEDEC standard JESD51-2 for additional information on optimizing the

thermal impedance (PCB with 3 × 3 vias).

ESD CAUTION

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