Data Sheet

HMC774ALC3B

Rev. A | Page 5 of 27

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

1

GND

7

GND

8

RF

9

GND

10

11

12

4

2

LO

3

GND

5

6

NOTES

1. NIC = NOT INTERNALLY CONNECTED. THESE PINS CAN BE

CONNECTED TO RF AND DC GROUND. PERFORMANCE IS

NOT AFFECTED.

2. EXPOSED PAD. THE EXPOSED PAD MUST BE CONNECTED

TO THE RF AND DC GROUND OF THE PCB.

TOP VIEW

(Not to Scale)

HMC774ALC3B

Figure 2. Pin Configuration

Table 5. Pin Function Descriptions

Pin No.

Mnemonic

Description

1, 3, 4, 6, 7, 9, 10, 12

GND

Ground. These pins must be connected to the RF and dc ground of the PCB. See Figure 3 for the

interface schematic.

2

LO

Local Oscillator Port. This pin is dc-coupled and matched to 50 Ω. For the maximum dc current

capability of this pin, see the Absolute Maximum Ratings section. See Figure 4 for the interface

schematic.

5

IF

Intermediate Frequency Port. For applications not requiring operation to dc, dc block this port

externally using a series capacitor of a value chosen to pass the necessary IF frequency range. For

operation to dc, this pin must not source or sink more than 3 mA of current or die malfunction and

possible die failure can result. See Figure 5 for the interface schematic.

8

RF

Radio Frequency Port. This pin is dc-coupled and matched to 50 Ω. For the maximum dc current

capability of this pin, see the Absolute Maximum Ratings section. See Figure 6 for the interface

schematic.

11

NIC

Not Internally Connected. These pins can be connected to RF and dc ground. Performance is not

affected.

EPAD

Exposed Pad. The exposed pad must be connected to the RF and dc ground of the PCB.

INTERFACE SCHEMATICS

GND

Figure 3. GND Interface Schematic

LO

Figure 4. LO Interface Schematic

IF

Figure 5. IF Interface Schematic

RF

Figure 6. RF Interface Schematic