Document Number: 28302

For technical questions contact: aluminumcaps1@vishay.com

www.vishay.com

Revision: 07-Nov-05

3

153 CLV

Aluminum Capacitors

SMD (Chip) Long Life Vertical

Vishay BCcomponents

Table 2

DIMENSIONS in millimeters AND MASS

NOMINAL

CASE SIZE

L

× W × H

CASE

CODE

∅DB

max

SC

MASS

(g)

4.0

× 4.0 × 5.3

0405

4.5

4.5

5.5

4.0

0.8

1.0

2.0

± 0.2

≈ 0.13

5.0

× 5.0 × 5.3

0505

5.5

5.5

5.5

5.0

0.8

1.4

2.3

± 0.2

≈ 0.20

6.3

× 6.3 × 5.3

0605

6.8

6.8

5.5

6.3

0.8

2.0

2.7

± 0.2

≈ 0.30

8.0

× 8.0 × 6.5

0807

8.6

8.6

6.8

8.0

0.8

2.3

3.4

± 0.2

≈ 0.50

8.0

× 8.0 × 10

0810

8.6

8.6

10.5

8.0

1.1

3.1

3.0

± 0.2

≈ 1.00

10

× 10 × 10

1010

10.6

10.6

10.5

10.0

1.1

4.7

3.3

± 0.2

≈ 1.30

10

× 10 × 12

1012

10.6

10.6

12.3

10.0

1.2

4.5

3.9

± 0.2

≈ 1.40

10

× 10 × 14

1014

10.6

10.6

14.3

10.0

1.2

4.5

3.9

± 0.2

≈ 1.50

Fig.2 Dimensional outline.

H

W B

0.3

max.

0.4

±0.2

D

CC

S

L

MOUNTING

The capacitors are designed for automatic placement on to

printed-circuit boards.

Optimum dimensions of soldering pads depend amongst

others on soldering method, mounting accuracy, print layout

and/or adjacent components.

For recommended soldering pad dimensions, refer to Fig.3

and Table 3.

SOLDERING

Soldering conditions are defined by the curve, temperature

versus time, where the temperature is that measured on the

soldering pad during processing.

For maximum conditions refer to Fig.4.

Any temperature versus time curve which does not exceed

the specified maximum curves may be applied.

AS A GENERAL PRINCIPLE, TEMPERATURE AND

DURATION SHALL BE THE MINIMUM NECESSARY

REQUIRED TO ENSURE GOOD SOLDERING

CONNECTIONS. HOWEVER, THE SPECIFIED MAXIMUM

CURVES SHOULD NEVER BE EXCEEDED.

Fig.3

Recommended soldering

pad dimensions.

c

a

a

b

Table 3

RECOMMENDED SOLDERING PAD

DIMENSIONS in millimeters

CASE CODE

a

b

c

0405

2.6

1.6

1.0

0505

3.0

1.6

1.4

0605

3.5

1.6

1.9

0807

4.0

1.6

2.1

0810

3.5

2.5

3.0

1010

4.0

2.5

4.0

1012

4.3

2.5

4.0

1014

4.3

2.5

4.0

250

280

80

0

50

200

180

150

100

200

220

240

260

160

140

120

100

T PAD

( C)

o

t (s)

Fig.4

Maximum temperature load during infrared reflow

soldering measured on the soldering pad.