27

LTC1968

1968f

PACKAGE DESCRIPTIO

MS8 Package

8-Lead Plastic MSOP

(Reference LTC DWG # 05-08-1660)

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-

tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.

TYPICAL APPLICATIO S

±2.5V Supplies, Single Ended, DC-Coupled

RMS-to-DC Converter with Shutdown

RMS Noise Measurement

2.5V

–2.5V

–2.5V

LTC1968

IN1

DC OUTPUT

10µF

0.1µF

X7R

IN2

1968 TA04

DC + AC

INPUT

OUT RTN

GND

EN

OFF

≥2V

≤–2V

ON

2.5V

–2.5V

2.5V

–2.5V

LTC1968

IN1

10µF

0.1µF

1.5µF

IN2

1968 TA05

VOLTAGE

NOISE IN

OUT RTN

GND

EN

–

+

1k

100Ω

100Ω

100k

BW ≈ 1kHz TO 100kHz

1/2

LTC6203

MSOP (MS8) 0204

0.53 ± 0.152

(.021 ± .006)

SEATING

PLANE

NOTE:

1. DIMENSIONS IN MILLIMETER/(INCH)

2. DRAWING NOT TO SCALE

3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.

MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.

INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX

0.18

(.007)

0.254

(.010)

1.10

(.043)

MAX

0.22 – 0.38

(.009 – .015)

TYP

0.127 ± 0.076

(.005 ± .003)

0.86

(.034)

REF

0.65

(.0256)

BSC

0° – 6° TYP

DETAIL “A”

DETAIL “A”

GAUGE PLANE

12

3

4

4.90 ± 0.152

(.193 ± .006)

8

7 6 5

3.00 ± 0.102

(.118 ± .004)

(NOTE 3)

3.00 ± 0.102

(.118 ± .004)

(NOTE 4)

0.52

(.0205)

REF

5.23

(.206)

MIN

3.20 – 3.45

(.126 – .136)

0.889 ± 0.127

(.035 ± .005)

RECOMMENDED SOLDER PAD LAYOUT

0.42 ± 0.038

(.0165 ± .0015)

TYP

0.65

(.0256)

BSC