EMC2302 datasheet(56/70 Pages) MICROCHIP

56 / 70 page

EMC2301/2/3/5

DS20006532A-page 56

 2021 Microchip Technology Inc.

Microchip Technology Drawing C04-021D Sheet 2 of 2

10-Lead Plastic Micro Small Outline Package (MS) [MSOP]

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

REF: Reference Dimension, usually without tolerance, for information purposes only.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Pin 1 visual index feature may vary, but must be located within the hatched area.

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or

Dimensioning and tolerancing per ASME Y14.5M.

protrusions shall not exceed 0.15mm per side.

Footprint

Mold Draft Angle

Lead Width

Lead Thickness

Dimension Limits

Overall Height

Molded Package Thickness

Molded Package Width

Overall Length

Foot Length

Standoff

Overall Width

Number of Pins

Pitch

Units

0.95 REF

0.08

0.15

0.23

0.33

MILLIMETERS

0.50 BSC

0.85

3.00 BSC

0.60

4.90 BSC

0.40

0.00

0.75

MIN

NOM

1.10

0.80

0.15

0.95

MAX

8°

0°

SEATING

PLANE

(L1)

DETAIL A

Foot Angle

15°

5°

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