Data Sheet

ADMV8432

Rev. A | Page 17 of 17

OUTLINE DIMENSIONS

0.50

BSC

BOTTOM VIEW

TOP VIEW

SIDE VIEW

EXPOSED

PAD

0.05 MAX

0.02 NOM

0.20 REF

4.50 REF

COPLANARITY

0.08

0.30

0.25

0.20

6.10

6.00 SQ

5.90

0.80

0.75

0.70

0.20 MIN

4.75

4.70 SQ

4.65

40

1

11

10

20

21

30

31

SEATING

PLANE

P IN 1

IN D IC ATO R AR E A OP T IO N S

(SEE DETAIL A)

DETAIL A

(JEDEC 95)

*COMPLIANT TO JEDEC STANDARDS MO-220-WJJD-5

WITH EXCEPTION TO LEAD LENGTH

PIN 1

INDICATOR

AREA

*0.35

0.30

0.25

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

Figure 45. 40-Lead Lead Frame Chip Scale Package [LFCSP]

6 mm × 6 mm Body and 0.75 mm Package Height

(CP-40-27)

Dimensions shown in millimeters

ORDERING GUIDE

Temperature Range

Package Description

Package Option

ADMV8432ACPZ

−40°C to +85°C

40-Lead Lead Frame Chip Scale Package [LFCSP]

CP-40-27

ADMV8432ACPZ-R5

−40°C to +85°C

40-Lead Lead Frame Chip Scale Package [LFCSP]

CP-40-27

ADMV8432-EVALZ

Evaluation Board

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registered trademarks are the property of their respective owners.

D20804-3/21(A)