MPXV4115V

Sensors

4

Freescale Semiconductor

ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION, AND SIGNAL CONDITIONING

The performance over temperature is achieved by

integrating the shear-stress strain gauge, temperature

compensation, calibration and signal conditioning circuitry

onto a single monolithic chip.

Figure 2 illustrates the gauge configuration in the basic

chip carrier (Case 482). A fluorosilicone gel isolates the die

surface and wire bonds from the environment, while allowing

the pressure signal to be transmitted to the silicon diaphragm.

The MPXV4115V series sensor operating characteristics

are based on use of dry air as pressure media. Media, other

than dry air, may have adverse effects on sensor

performance and long-term reliability. Internal reliability and

qualification test for dry air, and other media, are available

from the factory. Contact the factory for information regarding

media tolerance in your application.

interfacing the output of the integrated sensor to the A/D input

of a microprocessor or microcontroller. Proper decoupling of

the power supply is recommended.

Figure 4 shows the sensor output signal relative to

differential pressure input. Typical, minimum and maximum

output curves are shown for operation over a temperature

range of 0

°C to 85°C using the decoupling circuit shown in

pressure range.

Figure 2. Cross-Sectional Diagram

(not to scale)

Figure 3. Recommended Power Supply Decoupling

and Output Filtering

(For additional output filtering, please refer to

Application Note AN1646.)

Figure 4. Applied Vacuum in kPa

(below atmospheric pressure)

Differential Sensing Element

P2

Wire Bond

Stainless

Steel Cap

Thermoplastic

Case

Die Bond

Lead

Frame

Die

Fluorosilicone

Gel Die Coat

P1

+5 V

1.0

µF

0.01

µF

470 pF

GND

IPS

OUTPUT

–115

–95

–75

–55

–35

–15

0

0.5

1

1.5

2

2.5

3

3.5

4

4.5

5

TRANSFER FUNCTION MPXV4115V

Transfer Function:

TEMP = 0-85°C

MIN

MAX