LTC4151 datasheet(80/82 Pages) AD

80 / 82 page

LTC4284

Rev. B

For more information www.analog.com

PACKAGE DESCRIPTION

5.00 ±0.10

NOTE:

1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

PIN 1

TOP MARK

(SEE NOTE 6)

43 44

BOTTOM VIEW—EXPOSED PAD

6.55 ±0.10

8.00 ±0.10

0.75 ± 0.05

0.75 ±0.05

R = 0.125

TYP

0.00 – 0.05

0.25 ±0.05

(UHG44) QFN 0417 REV 0

0.50 BSC

0.325 REF

0.200 REF

6.50 REF

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED

3.50 REF

0.40 ±0.10

0.00 – 0.05

0.70 ±0.05

0.50 BSC

1.00 BSC

6.50 REF

3.50 REF

4.10 ±0.05

5.50 ±0.05

0.25 ±0.05

6.55 ±0.05

3.55 ±0.05

7.10 ±0.05

8.50 ±0.05

PACKAGE

OUTLINE

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION

ON THE TOP AND BOTTOM OF PACKAGE

PIN 1 NOTCH

R = 0.30 TYP OR

0.35 × 45° CHAMFER

UHG Package

44-Lead Plastic QFN (5mm × 8mm)

(Reference LTC DWG # 05-08-1581 Rev Ø)

3.55 ±0.10

DETAIL A

0.08 REF

0.31 REF

DETAIL A

LTC4151 데이터시트(PDF) 80 Page - Analog Devices

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