SMD datasheet(6/8 Pages) LEIDITECH

6 / 8 page

● Recommended reflow methods: IR, vapor phase oven, hot air oven, N2 environment for lead-free.

● Devices are not designed to be wave soldered to the bottom side of the board.

● Recommended maximum paste thickness is 0.25mm (0.010inch).

● Devices can be cleaned using standard industry methods and solvents.

Note 1: All temperature refer to topside of the package,measured on the package body surface.

Note 2: If reflow temperature exceed the recommended profile,devices may not meet the performance requirements.

Profile Feature

Pb-Free Assembly

Average ramp up rate(TsMAX to Tp)

3℃/second max.

Preheat

●Temperature min.(Ts

MIN)

150℃

●Temperature max.( Ts

MAX)

200℃

●Time (Ts

MIN to TsMAX)

60-120 seconds

Time maintained above:

●Temperature (T

217℃

●Time (T

60-150 seconds

Peak/Classification temperature (TP)

260℃

Time within 5℃ of actual peak temperature

Time (TP)

30 seconds max.

Ramp down rate

3℃/second max.

Time 25℃ to peak temperature

8 minutes max.

Rev :

www.leiditech.com

01.06.2018

6/8

SMD1210P150L~750L Series

SMD 데이터시트(PDF) 6 Page - Shanghai Leiditech Electronic Technology Co., Ltd