ADP5360ACBZ-1-R7 datasheet(9/60 Pages) AD

9 / 60 page

Data Sheet

ADP5360

Rev. 0 | Page 9 of 60

ABSOLUTE MAXIMUM RATINGS

Table 7.

Parameter

Rating

VBUS to PGND1

−0.5 V to +20 V

PGND1, PGND2 to AGNDx

−0.3 V to +0.3 V

All Other Pins to AGNDx

−0.3 V to +6 V

Continuous Drain Current, Battery

Supplementary Mode from ISOB toVSYS,

TJ = 85°C

1.1 A

Temperature Range

Storage

−65°C to +150°C

Operating Junction

−40°C to +85°C

Soldering Conditions

JEDEC J-STD-020

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to

PCB thermal design is required.

θJA is the natural convection, junction to ambient, thermal

resistance measured in a one cubic foot sealed enclosure. θJC is

the junction to case thermal resistance.

Table 8. Thermal Resistance

Package Type

θJA

θJC

Unit

CB-32-2

0.35

°C/W

MAXIMUM POWER DISSIPATION

The maximum safe power dissipation in the ADP5360 package

is limited by the associated rise in TJ on the die.At approximately

150°C, which is the glass transition temperature, the plastic

changes properties. Even temporarily exceeding this temperature

limit can change the stresses that the package exerts on the die,

permanently shifting the parametric performance of theADP5360.

ESD CAUTION

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