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ADUCM4050BCBZ-R7 데이터시트(PDF) 45 Page - Analog Devices |
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ADUCM4050BCBZ-R7 데이터시트(HTML) 45 Page - Analog Devices |
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45 / 46 page ![]() Data Sheet ADuCM4050 Rev. A | Page 45 of 46 OUTLINE DIMENSIONS A B C D E F G H 0.530 0.470 0.410 3.61 3.57 3.53 3.20 3.16 3.12 1 2 3 4 5 BOTTOM VIEW (BALL SIDE UP) TOP VIEW (BALL SIDE DOWN) SIDE VIEW 0.210 0.180 0.150 0.320 0.290 0.260 0.280 0.240 0.200 2.45 REF 2.80 REF 0.35 BALL PITCH 0.385 0.355 6 7 8 9 COPLANARITY 0.05 BALL A1 IDENTIFIER SEATING PLANE Figure 29. 72-Ball Wafer Level Chip Scale Package [WLCSP] (CB-72-3) Dimensions shown in millimeters 0.30 0.25 0.18 0.80 0.75 0.70 0.50 BSC BOTTOM VIEW TOP VIEW 6.30 6.20 SQ 6.10 0.05 MAX 0.02 NOM 0.203 REF COPLANARITY 0.08 9.10 9.00 SQ 8.90 FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. 0.20 MIN 7.50 REF COMPLIANT TO JEDEC STANDARDS MO-220-WMMD 1 64 16 17 49 48 32 33 0.45 0.40 0.35 EXPOSED PAD END VIEW DETAIL A (JEDEC 95) P IN 1 IN D IC AT O R AR E A OP T IO N S (SEE DETAIL A) PIN 1 INDICATOR AREA SEATING PLANE Figure 30. 64-Lead Lead Frame Chip Scale Package [LFCSP] 9 mm × 9 mm Body and 0.75 mm Package Height (CP-64-17) Dimensions shown in millimeters |
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